Systems with physical vapor deposition

Conventional categories of vacuum vapor deposition processes include Chemical vapor deposition (CVD), physical vapor deposition (PVD), evaporation through vacuum sublimation, or occasionally a combination of the aforementioned methods. These are just some of the ways to develop a thin film. Physical vapor deposition (PVD) describes various methods of vacuum deposition that can be used to produce thin films. PVD uses a physical process (heating or spraying) to produce steam material, which is then deposited on an object that requires coating. PVD is used in the production of articles that require a thin film for mechanical, optical, chemical or electronic functions. As part of the PVD system (Physical vapor deposition), Kvark, as a representative of the global American company TORR International Inc., a specialist in nanotechnology and thin film technology, offers you a variety of basic and upgradeable systems, made according to specific customer needs:

• Sputtering system (Magnetron and Ion beam system),
• Evaporation system (Electron beam and Resistive thermal evaporation system),
• Combination system.

Magnetron burst systems are used for applications of various sample preparation for scanning using electron microscopes or research and development with metal, dielectric and polymer films. TORR International Inc. produces custom multi-target sophisticated systems for special applications.